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Amphenol Canada
sales@amphenolcanada.com
(416) 291-4401

Micro-D

ENGINEERED SOLUTIONS DESIGNED TO FIT

The Amphenol micro-miniature connector series offers proven military spec performance and reliability in rectangular and stripline micro connectors. Microminiature connectors are available in rectangular D, strip and custom card edge configurations, with contacts on .050 (1.27) centers. Inserts in micro-d miniature connectors with signal and coax/power contacts are also available.  The socket contact is a precision fabricated tube. Pin and socket contacts are epoxy retained in high-grade thermoplastic insulators. The contact system has proven reliability, exceeding the performance specifications of MIL-DTL-83513. Terminations are available in a broad range including solder cup, terminated to wire harness, vertical and right angle PCB. Plastic and metal shell versions are available, in a broad range of shell finishes. A broad range of mounting hardware is available (jackscrews, posts, guide pins) as well as straight and angled back-shell.

FEATURES AND BENEFITS

  • Amphenol design not like other stamped and formed designs
  • Fully qualified per MIL-DTL-83513 requirements
  • One piece contact with equally spaced compliant tines
  • Gold over Nickel versus gold over the copper flash barrier
  • Tighter control over plating process
  • Uniform Plating thickness
  • Automated Stamping versus twist process variations
  • Integrated closed engaging end ensures uniform insertion forces
  • Low mating/unmating force
  • Preferred contact for space and satellite applications
  • Continuous connection along the length of the contact beam (line contact) versus multi-point connection (point contact)

MARKETS


DOCUMENTS


MICRO-MINIATURE CONTACT SYSTEM

The Micro-miniature contact system employs a precision stamped and formed pin contact recessed within the plug insulator. The contact system has proven reliability, exceeding the performance specifications of MIL-DTL-83513.

MICRO-D STRIP CONNECTOR

One piece insulator: Polyphenylene sulfide (Ryton) Contacts (1-30 positions): Copper alloy, gold plate Guide pin (optional, one or both ends): 300 series stainless steel Wide selection of wire sizes, types, and color finish. Coupling feature: Friction Contact spacing: .050" (1.27) centres

MICRO-D CONNECTOR SAVER

  • A Connector Saver provides protection against excessive wear subjected to excessive mating and un-mating during any process or testing.
  • Space reduction (2 in 1 connectors)
  • Opposite mating genders
  • No termination required ready to us

HI-DENSITY CARD CONNECTOR

Designed for a space-conscious industry. Provides an extremely dense and reliable interconnection for card-to-card and card-to-cable applications. Connector performance per M83513 specifications. Available in vertical mount for thru-hole applications and wire harness termination styles for both plug and receptacle.Wide selection of wire sizes (24 thru 30). Shell employs a polarizing "D" shape for correct mating.

PERFORMANCE SPECIFICATIONS
Contact Rating:   3 amps max.
Magnetic Permeability: ASTM-A342/A342M 2.0 µ max.
Dielectric Withstanding Voltage (DWV) :
Test voltage rms 60Hz ac volts
EIA-364-20 At sea level: 600 vac for solder pot and standard wire at 70,000 ft altitude (reduced barometric pressure): 150 vac for solder pot and standard wire
Insulation Resistance: EIA-364-21 5000 megohms min.
Contact Resistance: EIA-364-23 8 milliohms at 3 amps
Contact Engagement Force: MIL-DTL-83513 6.0 oz. max.
Contact Separation Force: MIL-DTL-83513 0.5 oz. min.
Connector Mating Force: MIL-DTL-83513 (10 oz. times no. of contacts) max.
Connector Unmating Force: MIL-DTL-83513 (0.5 oz. times no. of contacts) min.
Thermal Shock (Temperature Cycling): EIA-364-32, condition I, 5 cycles No physical damage -55°C to +125°C (-67°F to +257°F)
Mechanical Shock (Specified Pulse): EIA-364-27, condition E No physical damage and no loosening of parts, No loss of continuity > 1 microsec.
Vibration: EIA-364-28, condition IV No physical damage and no loosening of parts, No loss of continuity > 1 microsec.
Durability: MIL-DTL-83513 500 mating cycles at a rate of 200 ±100 CPH
Salt Spray (Corrosion): EIA-364-26, condition B Meets mateability and contact resistance requirements
Fluid Immersion: MIL-DTL-83513 Meets mateability requirements
Humidity: EIA-364-31 Meets D.W.V. and insulation resistance requirements 1 megohm nim. after step 6, 1000 megohms min. after 24 hrs. of conditioning
Insert Retention (class M): MIL-DTL-83513 50 lbs. min. (axial load)
Solderability: MIL-STD-202, method 208 Withstand test conditions
Contact Retention E: IA-364-29 5 lbs. min. (axial load)
Thermal Vacuum Outgassing (Space Classes): SP-R-0022 or ASTM E595 Exceeds MIL-DTL-83513 requirements; standard is 1.0% max TML and 0.1% max VCM or original mass

MATERIAL SPECIFICATIONS
Shell Material: Std. Metal (100, 106, 110 & M13 Series) Aluminum alloy 6061-T6 per QQ-A-200/8
104 Series Stainless Steel
Std. Plastic (101, 102 & 105 Series) Polyphenylene sulfide (Ryton)
High Temp Plastic High-performance thermoplastic (PEEK or equivalent)
Shell Finish (Metal Shells only): Anodized, Cadmium, Gold, Irridite/Alodine Electroless Nickel, Tin
Insulator/PCB Backshell: Polyphenylene sulfide (Ryton) per MIL-M-24519, type GST-40F; color: Black
Contacts: Copper alloy, 50 micro-inches gold plate over nickel
Hardware: Stainless Steel, Passivated
Potting Material: Std. Epoxy EP1730-1 or equivalent; color: Black
High Temp Epoxy EP173859 or equivalent