Micro-D Connectors M83513
ENGINEERED SOLUTIONS DESIGNED TO FIT
The Amphenol Micro-D connector series (M83513) offers proven military spec performance and reliability in rectangular and stripline micro connectors. The Micro-D connectors are available in rectangular D, strip and custom card edge configurations, with contacts on .050 (1.27) centers. Inserts in Micro-D miniature connectors with signal and coax/power contacts are also available. The socket contact is a precision fabricated tube. Pin and socket contacts are epoxy retained in high-grade thermoplastic insulators. The contact system has proven reliability, exceeding the performance specifications of MIL-DTL-83513. Terminations are available in a broad range including solder cup, terminated to wire harness, vertical and right angle PCB. Plastic and metal shell versions are available in Micro-D series, in a broad range of shell finishes. A broad range of mounting hardware is available (jackscrews, posts, guide pins) as well as straight and angled back-shell.
FEATURES AND BENEFITS
- Amphenol design is not like other stamped and formed designs
- Fully qualified per MIL-DTL-83513 requirements for Micro-D
- One-piece contact with equally spaced compliant tines
- Gold over Nickel versus gold over the copper flash barrier
- Tighter control over plating process
- Uniform Plating thickness
- Automated Stamping versus twist process variations
- Integrated closed engaging end ensures uniform insertion forces
- Low mating/unmating force
- Preferred contact for space and satellite applications
- Continuous connection along the length of the contact beam (line contact) versus multi-point connection (point contact)
MARKETS
DOCUMENTS
Micro-D Connector Products
MICRO-MINIATURE CONTACT SYSTEM
The Micro-miniature contact system employs a precision stamped and formed pin contact recessed within the plug insulator. The contact system has proven reliability, exceeding the performance specifications of MIL-DTL-83513 for Micro-D.
MICRO-D STRIP CONNECTOR
One piece insulator: Polyphenylene sulfide (Ryton) Contacts (1-30 positions): Copper alloy, gold plate Guide pin (optional, one or both ends): 300 series stainless steel Wide selection of wire sizes, types, and color finish. Coupling feature: Friction Contact spacing: .050" (1.27) centres
MICRO-D CONNECTOR SAVER
- A Connector Saver provides protection against excessive wear subjected to excessive mating and un-mating during any process or testing.
- Space reduction (2 in 1 connectors)
- Opposite mating genders
- No termination required ready to us
HI-DENSITY CARD CONNECTOR
Designed for a space-conscious industry. Provides an extremely dense and reliable interconnection for card-to-card and card-to-cable applications. Micro-D Connector performance per M83513 specifications. Available in vertical mount for thru-hole applications and wire harness termination styles for both plug and receptacle.Wide selection of wire sizes (24 thru 30). Shell employs a polarizing "D" shape for correct mating.
| PERFORMANCE SPECIFICATIONS MICRO-D | ||
| Contact Rating: | 3 amps max. | |
| Magnetic Permeability: | ASTM-A342/A342M | 2.0 µ max. |
| Dielectric Withstanding Voltage (DWV) : Test voltage rms 60Hz ac volts |
EIA-364-20 | At sea level: 600 vac for solder pot and standard wire at 70,000 ft altitude (reduced barometric pressure): 150 vac for solder pot and standard wire |
| Insulation Resistance: | EIA-364-21 | 5000 megohms min. |
| Contact Resistance: | EIA-364-23 | 8 milliohms at 3 amps |
| Contact Engagement Force: | MIL-DTL-83513 | 6.0 oz. max. |
| Contact Separation Force: | MIL-DTL-83513 | 0.5 oz. min. |
| Connector Mating Force: | MIL-DTL-83513 | (10 oz. times no. of contacts) max. |
| Connector Unmating Force: | MIL-DTL-83513 | (0.5 oz. times no. of contacts) min. |
| Thermal Shock (Temperature Cycling): | EIA-364-32, condition I, 5 cycles | No physical damage -55°C to +125°C (-67°F to +257°F) |
| Mechanical Shock (Specified Pulse): | EIA-364-27, condition E | No physical damage and no loosening of parts, No loss of continuity > 1 microsec. |
| Vibration: | EIA-364-28, condition IV | No physical damage and no loosening of parts, No loss of continuity > 1 microsec. |
| Durability: | MIL-DTL-83513 | 500 mating cycles at a rate of 200 ±100 CPH |
| Salt Spray (Corrosion): | EIA-364-26, condition B | Meets mateability and contact resistance requirements |
| Fluid Immersion: | MIL-DTL-83513 | Meets mateability requirements |
| Humidity: | EIA-364-31 | Meets D.W.V. and insulation resistance requirements 1 megohm nim. after step 6, 1000 megohms min. after 24 hrs. of conditioning |
| Insert Retention (class M): | MIL-DTL-83513 | 50 lbs. min. (axial load) |
| Solderability: | MIL-STD-202, method 208 | Withstand test conditions |
| Contact Retention E: | IA-364-29 | 5 lbs. min. (axial load) |
| Thermal Vacuum Outgassing (Space Classes): | SP-R-0022 or ASTM E595 | Exceeds MIL-DTL-83513 requirements; standard is 1.0% max TML and 0.1% max VCM or original mass |
| MATERIAL SPECIFICATIONS MICRO-D | ||
| Shell Material: | Std. Metal (100, 106, 110 & M13 Series) | Aluminum alloy 6061-T6 per QQ-A-200/8 |
| 104 Series | Stainless Steel | |
| Std. Plastic (101, 102 & 105 Series) | Polyphenylene sulfide (Ryton) | |
| High Temp Plastic | High-performance thermoplastic (PEEK or equivalent) | |
| Shell Finish (Metal Shells only): | Anodized, Cadmium, Gold, Irridite/Alodine Electroless Nickel, Tin | |
| Insulator/PCB Backshell: | Polyphenylene sulfide (Ryton) per MIL-M-24519, type GST-40F; color: Black | |
| Contacts: | Copper alloy, 50 micro-inches gold plate over nickel | |
| Hardware: | Stainless Steel, Passivated | |
| Potting Material: | Std. Epoxy | EP1730-1 or equivalent; color: Black |
| High Temp Epoxy | EP173859 or equivalent | |